The HUB-TOWER provides design engineers additional expansion for the Freescale Tower System. With easy access to the rugged StackableUSB connector, users can effortlessly evaluate plug-and-play ¼-size (1.85” x 1.74”) StackableUSB I/O devices.  From wireless to GPS to serial conversion, OEMs are able to cost-effectively explore a wealth of peripheral functions for their embedded system. 

By offering OEMs the flexibility to build on the number of USB, SPI, and I2C ports, the HUB-TOWER  opens the door for R&D engineers to evaluate a potential design in its entirety rather than one board/chip at a time. 

For garnering more I/O flexibility and capacity on a variety of form factors, Nano-ITX, Pico-ITX, 104 Form Factor™, SUMIT-ISM, and COM Express versions are available as well (contact Micro/sys Sales Team at sales@embeddedsys.com or 818-244-4600).

SPECIFICATIONS:

Mechanical:
•  Freescale Tower form factor
•  3.543” x 3.197”
•  ¼-size 104 Form Factor mounting holes

Power Requirements:
•  +5v ±5% supplied by power header
•  200 mA (min)
(Current requirements dependent on USB devices plugged into HUB-TWR)

Environmental:
•  -40° to +85°C operating 
•  -40° to +85°C storage
•   5%-95% relative humidity, non-condensing

Interface:
•  StackableUSB
•  I2C
•  SPI

Connections:
•  Tower card-edge connectors for USB, I2C, and SPI
•  Two (2) ¼-size 104 Form Factor StackableUSB