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  ALXD900EEYJ2

Low power and high performance offer x86 designers the capability to create without compromise.

The AMD Geode™ LX processor family consists of three versatile and powerful products - the AMD Geode™ LX 800@0.9W* processor, the AMD Geode™ LX 700@0.8W processor** and the AMD Geode™ LX 900@1.5W***
The AMD Geode™LX processor family offers new levels of performance and power versatility in an x86-based embedded processor:

LX 700@0.8W processor

  • Operates at a maximum of 3.1W (TDP) and 1.3W is typical at 433 MHz
  • CPU Core power is 0.8W
  • Interfaces to 333 MHz DDR memory and operates at 1.2V
  • 2-Kbit EEPROM option
  • Operating Case temperature = 85°C

LX 800@0.9W processor

  • Operates at a maximum power of 3.6W (TDP) and 1.8W is typical at500 MHz
  • CPU Core power is 0.9W
  • Interfaces to 400 MHz DDR memory and operates at 1.25V
  • 2-Kbit EEPROM option
  • Operating Case temperature = 85°C

LX 900@1.5W processor

  • Operates at a maximum power of 5.1W (TDP) and 2.8W is typical at 600 MHz
  • CPU Core power is 1.5W
  • Interfaces to 400 MHz DDR memory and operates at 1.4V
  • 2-Kbit EEPROM is NOT an option
  • Operating Case temperature = 80°C

Design with greater efficiency

Designers can now focus on developing end products that efficiently meet consumer needs with far fewer limits imposed by software porting or compatibility.   

  • x86/x87-compatible core
  • Processor frequency
  • – LX 900, up to 600MHz– LX 800, up to 500MHz– LX 700, up to 433MHz
  • 64K I/64K D L1 cache and 128K L2 cache
  • Split I/D cache/TLB (Translation Look-Aside Buffer)
  • 64-bit DDR Memory interface up to 600MHz (LX 900), up to 400MHz (LX 800), up to 333MHz (LX 700)
  • Integrated FPU that supports the Intel MMX® and AMD 3DNow!™ Technology instruction sets
  • 9 GB/s internal GeodeLink™ Interface Unit (GLIU)
  • Security Block
  • - 128-bit AES (CBC/ECB)- True Random Number Generator
  • High-resolution CRT and TFT outputs (simultaneous operation)
  • - Support for High Definition (HD) and Standard Definition (SD) standards - Support 1920x1440 in CRT mode and 1600x1200 in TFT mode
  • VESA 1.1 and 2.0 VIP/VDA support
  • 0.13 micron process
  • 481-terminal PBGA (Plastic Ball Grid Array) with internal heat spreader

Power management

  • 2.6W Typical (5.1W TDP) @ 600MHz
  • 1.8W Typical (3.9W TDP) @ 500MHz
  • 1.3W Typical (3.1W TDP) @ 433MHz
  • GeodeLink active hardware power management
  • Hardware support for standard ACPI software power management
  • I/O companion SUSP#/SUSPA# power controls
  • Lower power I/O
  • Wakeup on SMI/INTR
  • Optional In-package 2KBit EEPROM

Ordering information

  • OPN:
    • ALXG900EEYJ2VH
    • ALXC800EETJCVC
    • ALXC800EETJCVD
    • ALXC800EETJ2VC
    • ALXC800EETJ2VD
    • ALXC700EETHCVC
    • ALXC700EETHCVD
    • ALXC700EETH2VC
    • ALXC700EETH2VD
    • ALXC900EEYJ2VH