Compact 13 mm × 13 mm package, large-capacity memory, and carefully selected functions such as 4-channel CAN and 2-channel FlexRay to enable development of smaller, lower-cost systems for popularly priced vehicles
SAN JOSE, Calif.--(BUSINESS WIRE)-- Renesas Technology America, Inc., today announced the SH74552 andSH74562 32-bit MCUs for advanced driver assistance system applications which are needed in automobile “active safety” systems for obstacle detection, risk avoidance, etc. The SH74552 and SH74562 MCUs feature acompact 13 mm × 13 mm package, 160 MHz high-speed operation, 1 MB ofhigh-speed on-chip flash memory, and on-chip functions such as 4-channel CAN.*1 Sample shipments will begin in May, 2010, in Japan.
The specifications of the SH74552 and SH74562 have been carefully selected for systems intended for popularly priced vehicles. By integrating in a compact package the capability for high-speed andfine-grained processing of large amounts of data from sensors, they makeit possible to build systems that are more compact and lower in cost. In addition, the SH74552 is equipped with a 2-channel FlexRay*2controller.
Renesas Technology’s SH7450 Series MCUs for advanced driver assistance applications combine on-chip flash memory and high-speed operation.Sample shipments of products with a high operating frequency of 240 MHz have already begun to manufacturers of luxury cars. In recent years, inresponse to rising market consciousness about safety, demand has grown for advanced driver assistance systems suitable not only for high-end vehicles, but for popularly priced vehicles such as eco-friendly cars and compact cars as well. The new SH74552 and SH74562 retain the high performance and special characteristics of the earlier products in theSH7450 Series and provide a carefully selected function set in a package with a mounting area that is 42% smaller.
The main features of the SH74552 and SH74562 are as follow:(1) Compact package measuring 13 mm × 13 mm for advanced driver assistance systems that are more compact and lower in cost The SH74552 and SH74562 employ a FBGA package measuring only 13 mm ×13 mm, deliver the high-speed operation and large-capacity memory necessary for high-speed and fine-grained processing of large volumes of data from sensors in applications such as obstacle detection and risk avoidance, and integrate on-chip peripheral functions such as CAN. They are based on Renesas Technology’s existing 240 MHz products (17 mm × 17 mm) and provide a carefully selected subset of their specifications, enabling them to achieve amounting area approximately 42% smaller. This makes it possible to build advanced driver assistance systems that require less space,are lower in cost, and are more lightweight, making them suitable for popularly priced vehicles. (2) High-speed operation at 160 MHz for advanced driver assistance systems with high performance The SH74552 and SH74562 deliver high-speed operation, with processing performance of 288 MIPS (million instructions per second)at the maximum operating frequency of 160 MHz. This enables them to process large volumes of data from sensors, etc., very rapidly. In addition, since these lower-end MCUs are based on the 240 MHz products that preceded them, existing software resources can be reused, making it possible to quickly develop advanced driver assistance systems for popularly priced vehicles by adapting systems originally intended for luxury cars. (3) Large-capacity flash memory and SRAM on-chip The SH74552 and SH74562 have an ample 1 MB of on-chip flash memory to accommodate the large software programs required by advanced driver assistance systems. Renesas Technology MCUs with on-chip flash memory have a proven track record in a wide range of fields,including automotive, consumer, and industrial equipment, and are highly regarded for their excellent reliability and high-speed operation. The SH74552 and SH74562 also have 256 KB of on-chip SRAM for storing large amounts of data such as milliwave data or imagedata from cameras. (4) Communication functions needed by vehicle networks such as FlexRay controller and CAN In an advanced driver assistance system, data detected by a sensor electronic control unit (ECU) linked to milliwave radar, cameras,etc., is transferred via a controller area network (CAN) to a sensor fusion ECU, which uses it to perform control functions. The SH74552and SH74562 integrate 4-channel CAN functionality to accommodate additional sensor or actuator ECUs for higher-performance advanced driver assistance systems. Going forward, the amount of communication data handled is expected to increase rapidly to support coordinated control among vehicle systems, and it is possible that the communication speed of the present CAN specification may prove inadequate. For this reason, theSH74552 is equipped with a 2-channel FlexRay controller, a next-generation backbone network specification providing faster communication speed and enhanced reliability.
Efforts to enhance safety and improve environmental performance have been gaining prominence in the automotive field. Demand for “passivesafety” (such as airbags) systems that decrease the harmful effects of traffic accidents have increasingly become joined by demand for “ active safety” measures such as advanced driver assistance systems that are designed to prevent traffic accidents proactively.
The idea of “active safety” is to detect ahead of time the possibility that an accident may occur under conditions of driver inattentiveness or poor visibility and to prevent an accident from occurring through cooperation between the driver and the vehicle. Going forward, systems based on this principle will be indispensable in achieving a truly safe driving experience in which both safety and convenience are enhanced.
Renesas Technology already mass produces the M32192, a 32-bit MCU with on-chip flash memory that is built around the M32R CPU core and designed for use in advanced driver assistance systems. It has achieved excellentresults in the advanced driver assistance system market. In addition,sample shipments of the SH74504 and SH74513 to many makers of high-endautomobiles have begun, the first two products in the SH7450 Series of240 MHz MCUs employing the SH-4A CPU core, which has a proven trackrecord in MCUs for car navigation systems.
In recent years, as the safety consciousness of the market hasincreased, strong demand has emerged for advanced driver assistancesystems suitable for popularly priced vehicles such as eco-friendly carsand compact cars, as well as luxury cars. This has increased demand forsystems that are more compact and less costly. In an effort to encouragethe spread of active safety systems, Renesas Technology is releasing theSH74552 and SH74562, smaller versions of the SH74504 and SH74513 thatretain their high performance and special characteristics whileproviding a carefully selected subset of their on-chip functions.
In addition to the CPU core, the SH74552 and SH74562 also incorporate afloating-point processing unit (FPU) operating at 160 MHz. The FPUsupports both single-precision and double-precision calculations, and insingle-precision operations it achieves a maximum performance of 1.12GFLOPS (giga [billion] floating-point operations per second). Hardwaresupport for vector operations and arithmetic operations such assine/cosine operations enables high-speed operation processing. TheSH74552 and SH74562 also have a wide operating temperature range (–40 to+125°C) to accommodate the wide temperature range under which advanceddriver assistance systems must operate. Finally, they incorporate acareful selection of the on-chip peripheral functions of the first twoproducts in the SH7450 Series.(A) On-chip functions needed for controlling vehicle cameras The following camera interface functions required by lane departurewarning systems, which detect the white lines on the road surfaceand issue warnings when the vehicle deviates from the lane, areintegrated on-chip. • For image data captured by CMOS cameras, the SH74552 and SH74562incorporate two clock synchronous parallel interface direct RAMinputs (DRIs) that are connected directly to the on-chip SRAM andsupport a maximum data transfer speed of 40 MB per second. Inaddition to a function for reading in an entire image at once, thereare built-in functions for selectively reading in only necessarypixels and for reading in images with a reduced pixel count. Thisallows more efficient utilization of the on-chip RAM and helps boostoperation efficiency. • A single-channel I2C function required for camerasettings is provided. This makes it possible to design systems thatare more compact and less costly. (B) On-chip functions needed for vehicle milliwave systems The following interface functions required by milliwave radarsystems such as adaptive cruise control systems that detectobstacles and pedestrians in front of the vehicle, automaticallytrack leading vehicles, and perform emergency braking, etc., areintegrated on-chip. • Parallel DAC controller (PDAC) circuit for D/A converter control • Parallel selector (PSEL) circuit for channel control of externalhigh-speed A/D converters (ADCs) • DRI circuit ideal for reading in data from external high-speed ADCs • Timer TOU for controlling a brushless DC motor (BLDC) as part ofmechanical milliwave scan control and 62-channel ATU-IIIS (AdvancedTimer Unit III) multifunction timer unit ideal for timing control These on-chip functions make it possible to build systems that aremore compact and lower in cost. (C) On-chip port-to-port communication function ideal for multi-MPUconfigurations In response to the constantly rising performance demands on advanceddriver assistance systems, the SH74552 and SH74562 incorporate thefollowing communications functions. • A direct RAM input interface (DRI) and direct RAM output interface(DRO) to minimize performance drag on the MCU’s CPU caused bycommunications functions • Serial communication interfaces (SCIF) with FIFO There is also an on-chip direct memory access controller (DMAC)supporting data transfer to external bus areas to enable managementof the above communication functions. By combining these functions,it is possible to utilize the maximal performance of the SH-4A CPUand to achieve improved system performance.
The compact package measures only 13 mm × 13 mm, and the individual pinsare multiplexed for up to six functions to provide support for a widerange of applications. The FBGA package has a 0.8 mm pin pitch and canwithstand operating temperatures up to 125°C.
Compilers, the E10A-USB on-chip debugging emulator, flash developmenttoolkits, and starter kits manufactured by Renesas Technology areavailable for use in system development. A variety of additionaldevelopment tools are available from third-party vendors.
Renesas Technology plans to continue to respond to market demand bydeveloping new products with a range of flash memory capacities andpackage options as well as higher operating frequencies, betterperformance, and more advanced functions for the systems of today andtomorrow.
NotesNotes: 1. CAN (Controller Area Network): An automotive network specificationpromoted by Robert Bosch GmbH of Germany. 2. FlexRay™: A communication protocol for next-generation vehiclecontrol applications that is promoted by the FlexRay Consortium.FlexRay is a registered trademark of Daimler AG.
* Other product names, company names, or brands mentioned are theproperty of their respective owners.
<Sample Prices in United States> *For Reference
About Renesas Technology Corp.
Renesas Technology Corp. is the world´s No.1 supplier ofmicrocontrollers and one of the world´s leading semiconductor systemsolutions providers for mobile, automotive and PC/AV (Audio Visual)markets. It is also a leading provider of Power MOSFETs, Smart Cardmicrocontrollers, RF-ICs, High Power Amplifiers, Mixed Signal ICs,System-on-Chip (SoC), System-in-Package (SiP) and more. Established in2003 as a joint venture between Hitachi, Ltd. (TSE:6501) (NYSE:HIT) andMitsubishi Electric Corporation (TSE:6503), Renesas Technology achievedconsolidated revenue of 702.7 billion JPY in FY2008 (end of March 2009).Renesas Technology is based in Tokyo, Japan and has a global network ofmanufacturing, design and sales operations in 16 countries with 25,000employees worldwide. For further information, please visit http://www.renesas.com
SpecificationsProduct name SH74552 SH74562 Product No. R5F74552KBG R5F74562KBG Power supply voltage Supply 1: for Internal Logic Voltage 1.5V
Supply 2: for I/O Voltage (3.3V or 5.0V)Max. operating frequency 160 MHz Processing performance 288 MIPS, 1.12 GFLOPS (operating at 160 MHz) CPU core SH-4A
Operating temperature range
-40 to +125°COn-chip ROM
(flash memory)1 Mbytes On-chip RAM
High-speed RAM: 8 Kbytes + 16 Kbytes (IL RAM and OL RAM),
Medium-speed RAM: 256 Kbytes (SHwyRAM or SRAM)Cache memory Separate, 32 Kbytes for instructions/32 Kbytes for data,
4-way set associativeFlexRay 2 channels -- Main on-chip peripheral functions Timer ATU-IIIS: 59 channels Timer TMU: 3 channels On-chip watchdog timer: 1 channel 12-bit A/D converter: 2 modules (AD0 12 input pins; AD1 4 input pins) Direct memory access controller: 12 channels Direct RAM input interface (DRI): 2 channels Direct RAM output interface (DRO): 1 channel Parallel DAC control interface (PDAC): 1 channel Parallel selector (PSEL): 1 channel Serial communication interface (3 x RSPI, 4 xSCIF, and I2C,):8 channels Controller area network (CAN): 4 channels (64 message boxes) Clock oscillator: Built-in multiplier PLL On-chip debug function (H-UDI) RAM monitor function (AUDR) Package 176-pin BGA (13 mm × 13 mm, 0.8 mm pin pitch)