Features

• Minimum instruction execution time can be changed from high speed (0.03125 μs: @ 32 MHz operation with internal high-speed oscillation clock) to ultra low-speed (30.5 μs: @ 32.768 kHz operation with subsystem clock)
  

• General-purpose register: 8 bits × 32 registers (8 bits × 8 registers × 4 banks)

• ROM: 16 to 512 KB, RAM: 2 to 32 KB, Data flash memory: −/4/8 KB

• On-chip internal high-speed oscillation clocks
•  Select from 32 MHz (TYP.), 24 MHz (TYP.), 16 MHz (TYP.), 12 MHz (TYP.), 8 MHz (TYP.), 4 MHz (TYP.), and 1MHz (TYP.)
  

• On-chip single-power-supply flash memory (with prohibition of block erase/writing function)

• Self-programming (with boot swap function/flash shield window function)

• On-chip debug function

• On-chip power-on-reset (POR) circuit and voltage detector (LVD)

• On-chip watchdog timer (operable with the dedicated internal low-speed oscillation clock)

• On-chip multiplier and divider/multiply-accumulator

• On-chip key interrupt function

• On-chip clock output/buzzer output controller

• On-chip BCD adjustment

• I/O ports: 16 to 120 (N-ch open drain: 0 to 4)

Timer

• 16-bit timer: 8 to 16 channels
• Watchdog timer: 1 channel
• Real-time clock: 1 channel (Correction clock output)
• Interval timer: 1 channel

Serial interface

• CSI
• UART/UART (LIN-bus supported)
• I2C/Simplified I2C communication

• Different potential interface: Can connect to a 2.5/3 V device when operating at 4.0 V to 5.5 V

• 8/10-bit resolution A/D converter (VDD = EVDD =1.6 to 5.5 V): 6 to 26 channels

• Standby function: HALT, STOP, SNOOZE mode

• Power supply voltage: VDD = 1.6 to 5.5 V

• Operating ambient temperature: TA = −40 to +85°C